H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 25/00 (2006.01) B81B 7/00 (2006.01) H01L 23/52 (2006.01) H05K 1/14 (2006.01)
Patent
CA 2366618
A self aligned electrical interconnect for two assembled perpendicular semiconductive chips is formed by a slot in a carrier chip having a notch with a metal trace. The other device chip is perpendicularly placed in the slot and has a matching metal trace. The chips are then bonded together by the traces to provide for fine perpendicular alignment of the assembled chips.
Lim Martin
Yun Weijie
Opticnet Inc.
Smart & Biggar
LandOfFree
Self-aligned electrical interconnect for two assembled... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Self-aligned electrical interconnect for two assembled..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self-aligned electrical interconnect for two assembled... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1483783