Self aligned gate jfet structure and method

H - Electricity – 01 – L

Patent

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H01L 31/112 (2006.01)

Patent

CA 2647600

A JFET integrated onto a substrate having a semiconductor layer at least and having source and drain contacts over an active area and made of first polysilicon (or other conductors such as refractive metal or suicide) and a self-aligned gate contact made of second polysilicon which has been polished back to be flush with a top surface of a dielectric layer covering the tops of the source and drain contacts. The dielectric layer preferably has a nitride cap to act as a polish stop. In some embodiments, nitride covers the entire dielctric layer covering the source and drain contacts as well as the field oxide region defining an active area for said JFET. An embodiment with an epitaxially grown channel region formed on the surface of the substrate is also disclosed.

La présente invention concerne un JFET intégré sur un substrat comportant au moins une couche semi-conductrice et comportant des contacts de source et de drain sur une zone active et constituée d'un premier polysilicium (ou d'autres conducteurs comme un métal réfringent ou un siliciure) et un contact de gâchette auto-aligné constitué d'un second polysilicium qui a été poli jusqu'à être de niveau avec la surface supérieure d'une couche diélectrique recouvrant le haut des contacts de source et de drain. La couche diélectrique comporte de préférence une couverture de nitrure servant d'arrêt de polissage. Dans certains modes de réalisation, le nitrure recouvre entièrement la couche diélectrique recouvrant les contacts de source et de drain ainsi que la zone d'oxyde de champ définissant une zone active dudit JFET. L'invention concerne également un mode de réalisation avec une zone de canal réalisée par croissance épitaxique sur la surface du substrat.

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