Self-aligning electrical contact array

Details Self-aligning electrical contact array Self-aligning electrical contact array

H - Electricity

05

K

H05K 1/02 (2006.01) B23K 1/20 (2006.01) H04B 1/16 (2006.01) H05K 1/11 (2006.01) H05K 3/34 (2006.01) H05K 13/04 (2006.01)

Patent

CA 2138032

A surface mount component placement arrangement includes a circuit supporting substrate (202) having a first surface (308), and disposed thereon are a first pad array (502) and a first at least one aligning pad (506). A component (802) has a second surface (801), the second surface (801) substantially opposing the first surface (308), and disposed on the second surface (801) are second pad array (406) and a second at least one aligning pad (508). The first and second pad arrays (406, 502) at least partially overlap with each other. The aligning pads (506, 508) at least partially overlap with each other relative to a second tolerance of the placement operation. The partially overlapping pair of pads (506, 508) are oriented relative to each other such that when solder therebetween is liquid the surface tension of the solder can move the component (802) relative to the circuit supporting substrate.

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