Self-compensating hydrostatic flattening of semiconductor...

Details Self-compensating hydrostatic flattening of semiconductor... Self-compensating hydrostatic flattening of semiconductor...

G - Physics

02

F

345/56, 345/8

G02F 1/00 (2006.01) G01B 11/26 (2006.01) H01L 21/302 (2006.01) H01L 31/0203 (2006.01)

Patent

CA 1202710

SELF-COMPENSATING HYDROSTATIC FLATTENING OF SEMICONDUCTOR SUBSTRATES ABSTRACT A semiconductive substrate (1), such as a silicon wafer, is mounted on a baseplate (3), for inclusion in an optical device such as a liquid crystal light valve. An optical flat (9) presses the top surface of the silicon wafer toward the baseplate and against a ring seal (5) surrounding a fluid adhesive (7). The fluid adhesive hydrostatically distributes the force of compression to guarantee optical flatness and self- compensation for the amount fluid adhesive surrounded by the O-ring. The optical flatness of the semiconductor substrate is limited only by the flatness of the optical flat against which it is compressed. Parallel alignment of the optical flat (9), the substrate (1) and the baseplate (3) is achieved by reflecting a laser beam (20) through the semiconductive substrate and observing the interference fringes therein, while adjusting the relative alignment so as to maximize the distance between fringes.

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