Self-locking heat sinks for surface mount devices

Details Self-locking heat sinks for surface mount devices Self-locking heat sinks for surface mount devices

H - Electricity

05

K

H05K 1/02 (2006.01) H01L 23/40 (2006.01)

Patent

CA 2129336

A structure for attaching a heat sink to an electronic package comprising a pin (10) having a compressible point (16), the point being adapted to pass through aligned holes in a heat sink (40) and a printed circuit board (60) so that the point compresses as it passes into two holes and flexes back to an expanded position after it exits the printed circuit board hole opposite the heat sink thereby holding the heat sink to the board with the electronic package (50) therebetween.

Structure permettant de relier un puits de chaleur à un module électronique comportant une broche (10) à pointe compressible (16), la pointe étant adaptée pour passer dans les orifices alignés se trouvant sur le puits de chaleur (40), et une carte à circuit imprimé (60), de sorte que la pointe se comprime lorsqu'elle passe dans deux orifices et reprend sa forme allongée lorsqu'elle ressort de l'orifice pratiqué dans la carte à circuit imprimé se trouvant à l'opposé du puits de chaleur, maintenant ainsi celui-ci sur la carte, le module électronique (50) étant situé entre les deux.

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