Self-positioning heat spreader

Details Self-positioning heat spreader Self-positioning heat spreader

H - Electricity

01

L

356/113, 347/36

H01L 23/34 (2006.01) H01L 23/367 (2006.01) H01L 23/433 (2006.01)

Patent

CA 1201817

A SELF-POSITIONING HEAT SPREADER ABSTRACT A heat spreader which is self-positioning into a mold cavity prior to encapsulation in plastic is provided. To minimize capacitance between the spreader and a metal lead frame having a semiconductor die mounted thereon, the heat spreader has a frame with notches in the opposite ends which define bifurcated limbs. Lateral standoffs extend from each of the sides thereof and feet extend from the bottom surface thereof. A central portion extends a predetermined distance from the top surface thereof for intimate positioning with the lead frame. The standoffs, limbs and feet are sized to firmly position the heat spreader upon insertion into the mold cavity. To maintain substantially constant capacitance between the spreader and the lead frame from part to part, each bifurcated limb has an inner edge which complements or conforms to the portion of the lead frame which will overlay the limb in the encapsulated plastic.

423966

Affiliated with

Also associated with

Rating

Self-positioning heat spreader does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Self-positioning heat spreader, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self-positioning heat spreader will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1336721