Semiconducteur device assembly

Details Semiconducteur device assembly Semiconducteur device assembly

H - Electricity

01

S

345/46, 345/62

H01S 3/101 (2006.01) H01S 3/08 (2006.01) H01S 3/098 (2006.01) H01S 3/105 (2006.01) H01S 5/14 (2006.01)

Patent

CA 1313909

ABSTRACT An external cavity laser assembly in which the laser chip is within a hermetically sealed package and the external cavity is outside the hermetic package. A collimating lens in a screw threaded mounting is disposed outside the hermetic package, the screw thread permitting focussing. The cavity is tuned by rotation and translation of a grating, the position of which is electrically controlled via piezoelectric stacks. Thermal expansion of the stacks is compensated by mounting the grating on a rod of suitable material (e.g. ceramic) which also serves to reduce the cavity length whilst allowing maximum piezoextension. In a second embodiment the assembly is a tunable laser amplifier, with a grating being driven in a similar manner to provide the tuning.

595110

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