Semiconductive polymer composition

H - Electricity – 01 – B

Patent

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Details

H01B 1/24 (2006.01) H01B 1/04 (2006.01) H01B 1/12 (2006.01) H01B 1/20 (2006.01)

Patent

CA 2574425

The present invention relates to a semiconductive polymer composition comprising a olefin homo- or copolymer wherein the composition has a direct current volume resistivity of less than 1000 Ohm.cm at 90 ~C, an elongation at break which after aging for 240 hours at 135 ~C does not change by more than 25 %, and a total number of structures of 20 or less in the SIED test. Furthermore, the present invention relates to an electric power cable comprising a conductor, a semicoducting layer and, adjacent to the semiconducting layer, an insulation layer, wherein the semiconducting layer is formed by said semiconductive polymer composition and to the use of said semiconducting polymer composition for the production of a semiconductive layer of an electric power cable.

La présente invention concerne une composition polymère semi-conductrice comprenant un homopolymère ou un copolymère d'oléfine, la composition présentant une résistivité volumique de courant direct inférieure à 1000 Ohms/cm à 90 °C, un allongement à la rupture qui, après vieillissement pendant 240 heures à 135 °C, ne change pas de plus de 25 %, ainsi qu'un nombre total de structures inférieur ou égal à 20 dans l'essai de dégradation électrochimique induite par la contrainte (SIED). De plus, la présente invention concerne également un câble d'alimentation électrique comprenant un conducteur, une couche semi-conductrice et, adjacente à la couche semi-conductrice, une couche isolante, la couche semi-conductrice étant formée par ladite composition polymère semi-conductrice. L'invention concerne en outre l'utilisation de ladite composition polymère semi-conductrice pour la production d'une couche semi-conductrice d'un câble d'alimentation électrique.

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