Semiconductive resin composition

Details Semiconductive resin composition Semiconductive resin composition

C - Chemistry, Metallurgy

08

L

31/158, 400/4918

C08L 23/08 (2006.01) C08K 3/04 (2006.01) H01B 1/24 (2006.01)

Patent

CA 1307366

ABSTRACT OF THE DISCLOSURE A semiconductive resin composition comprising 100 parts by weight of a polymer component comprising an ethylene-based copolymer, an ethylene-propylene rubber, and a low molecular weight polyethylene having an average molecular weight of 1,000 to 4,000, and 40 parts by weight or more of electroconductive carbon black.

577053

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