Semiconductor base material and method of manufacturing the...

H - Electricity – 01 – L

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H01L 21/205 (2006.01) C30B 25/02 (2006.01) C30B 25/18 (2006.01) C30B 29/38 (2006.01) C30B 29/40 (2006.01) H01L 21/20 (2006.01) H01S 5/323 (2006.01)

Patent

CA 2422624

A semiconductor base material, comprising a substrate (1) having an irregular epitaxial growth surface shown in Fig. 1 (a), wherein, when the vapor phase epitaxial growth of GaN crystals is performed, the irregular surface suppresses a lateral growth and promotes a growth in C-axis direction so as to form a base surface allowing a facet surface to be formed thereon and, as shown in Fig. 1 (b), the crystals having the facet surface formed thereon grow on projected parts and also on recessed parts and, when the crystal growth is further performed, the films grown from the projected and recessed parts are connected to each other to eventually cover the irregular surface as shown in Fig. 1 (c) for flattening and, in this case, and area with low dislocation density is formed at the top parts of the projected parts having the facet surface formed thereon to increase the quality of the film.

L'invention concerne un matériau de base semi-conducteur, comprenant un substrat (1) présentant une surface de croissance épitaxiale irrégulière, comme le montre la fig.1 (a). Lorsque se produit la croissance épitaxiale en phase vapeur des cristaux GaN, la surface irrégulière supprime une croissance latérale et génère une croissance dans une direction en axe C de manière à former une surface de base sur laquelle peut être formée une surface à facettes et, comme le montre la fig.1 (b), les cristaux sur lesquels est formée la surface à facettes se développent sur les parties en saillie ainsi que sur les parties en retrait. Lorsque la croissance du cristal se produit, les films obtenus des parties en saillie et en retrait sont connectés les uns aux autres pour finalement recouvrir la surface irrégulière, comme le montre la fig.1 (c), afin de l'aplatir et, dans ce cas, une zone à faible densité de dislocation est formée sur les parties supérieures des parties en saillie comprenant la surface à facettes de manière à augmenter la qualité du film.

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