Semiconductor chip assemblies, methods of making same and...

Details Semiconductor chip assemblies, methods of making same and... Semiconductor chip assemblies, methods of making same and...

H - Electricity

01

L

H01L 23/50 (2006.01) H01L 21/60 (2006.01) H01L 21/822 (2006.01) H01L 21/98 (2006.01) H01L 23/12 (2006.01) H01L 23/13 (2006.01) H01L 23/14 (2006.01) H01L 23/31 (2006.01) H01L 23/48 (2006.01) H01L 23/485 (2006.01) H01L 23/498 (2006.01) H01L 23/58 (2006.01)

Patent

CA 2091438

Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.

Ensembles puces à semi-conducteurs incorporant des éléments flexibles en forme de couche (42) et portant des bornes qui recouvrent la face avant et arrière de la puce pour constituer une unité compacte. Les bornes (48) se trouvant sur l'élément en forme de couche sont mobiles par rapport à la puce, afin de pouvoir compenser la dilatation thermique. Un élément résilient, tel qu'une couche déformable (42), disposé entre la puce et les bornes permet un mouvement indépendant des diverses bornes vers l'appui de commande de la puce avec l'ensemble sonde de test afin d'assurer une prise fiable en dépit des tolérances.

Affiliated with

Also associated with

Rating

Semiconductor chip assemblies, methods of making same and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip assemblies, methods of making same and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip assemblies, methods of making same and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1684231