Semiconductor chip module and method for manufacturing the same

Details Semiconductor chip module and method for manufacturing the same Semiconductor chip module and method for manufacturing the same

H - Electricity

05

K

H05K 7/20 (2006.01) H01L 23/10 (2006.01) H01L 23/433 (2006.01) H05K 13/04 (2006.01)

Patent

CA 2070743

Abstract of the Disclosure The present invention according to the semiconductor chip module comprises a substrate on which a wiring portion is formed, a semiconductor chip mounted on the wiring portion so as to face the circuit side thereof down to the wiring portion, a heat sink having one end portion contacting the side opposite to the circuit surface of the semiconductor chip, and a cap enclosing the semiconductor chip and having an opening for exposing externally the other end portion of the heat sink.

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