H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/172
H01L 23/495 (2006.01) H01L 23/051 (2006.01)
Patent
CA 1151318
ABSTRACT OF THE DISCLOSURE A large area semiconductor disk, wherein in order to be able to material-connect, for example, by soldering, welding or diffusion- bonding the semiconductor disk with copper disks serving for the heat conduction and for the current supply, a copper tape wound to form a spiral is used to make the connection between the two disks. Trans- verse slots are etched or punched into the copper tape so that free V-shaped crosspieces are formed on one side. The ends of the cross- pieces are material-connected with the silicon disk, and measures are taken so that the crosspieces do not connect with each other. The other side of the wound tape is soldered to the copper disk. The radial thermal expansion differences between the copper disk and silicon disks, as well as the axial thermal expansion differences between the silicon disk and the casing, as well as production toler- ances in the planeness of the copper and silicon disks are absorbed elastically by the corresponding V-shape of the crosspieces.
360124
Holick Hubert
Jester Alfred
Bbc Brown Boveri & Company
Swabey Ogilvy Renault
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