H - Electricity – 01 – L
Patent
H - Electricity
01
L
345/26, 356/8
H01L 31/00 (2006.01) G02B 6/42 (2006.01) H01L 21/60 (2006.01) H01L 21/603 (2006.01) H01L 23/482 (2006.01) H01L 29/06 (2006.01) H01L 31/0203 (2006.01) H01L 33/00 (2006.01)
Patent
CA 1209716
ABSTRACT A Semiconductor Component and Method of Manufacture An electronic component comprises a mounting substrate (13) having a surface provided with a plurality of spaced contact pads (15) and a semiconductor chip (10) having at least one active element (11) and a surface provided with metallised contact regions (14). The metallised contact regions (14) are superimposed on and electrically conductively bonded to a different one of the mounting substrate contact pads (15). The method comprises the forming on a surface of a semiconductor chip at least one active device having a raised metallised contact region and at least one additional raised contact region spaced from the active device contact region. A metallised contact pad for each of the raised contact regions is provided on a mounting substrate their spacing corresponding to the spacing of the raised contact regions. The contact pad for each active device is arranged to form part of a conductor connection. The chip is positioned on the mounting substrate with the associated raised contact regions and contact pads in mutual contact and they are electrically conductively bonded together.
451170
Goodfellow Robert C.
Sussmann Ricardo S.
Bookham Technology Plc
Borden Ladner Gervais Llp
Plessey Overseas Limited
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