Semiconductor component embedded in a compound-filled cup

H - Electricity – 01 – L

Patent

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356/167

H01L 23/28 (2006.01) H01L 23/051 (2006.01) H01L 23/49 (2006.01)

Patent

CA 1213078

ABSTRACT OF THE DISCLOSURE In a compound-filled cup is fitted a semiconductor body provided with junction members on both sides. The semiconductor body has a control line which is coupled with a connection contact. The connection contact is attached on the cup wall and has a section protruding into the space between the inner side of the cup wall and the semiconductor body, which section is electrically connected with the control line. -13-

453684

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