Semiconductor device

Details Semiconductor device Semiconductor device

H - Electricity

01

L

356/110, 356/173

H01L 29/86 (2006.01) H01L 21/52 (2006.01) H01L 23/049 (2006.01) H01L 23/48 (2006.01)

Patent

CA 1234228

ABSTRACT OF THE DISCLOSURE A semiconductor device comprises a semiconductor element mounted on a support member, an elastic body which provides pressure to the semiconductor element, forcing the semiconductor element into pressure-contact with the support member and a cylindrical body for containing the semiconductor element and the elastic body in a container area. A lower end of the cylindrical body is fixed to the support member, and a plurality of bent projections are produced so as to be in contact with an upper end of the elastic body by bending at least three points of a top end of the cylindrical body, folding the top end of the cylindrical body into the container area, while pressure is applied to the semiconductor element by the elastic body.

486075

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