H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/32 (2006.01) H01L 23/14 (2006.01) H01L 23/373 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01) H01L 23/66 (2006.01)
Patent
CA 2092767
ABSTRACT OF THE DISCLOSURE A semiconductor device which can reduce noise, which can be used for a variety of different purposes in a flexible manner, and which is suitable for automatic assembly. It has a metal board carrying a semiconductor device chip on the central part thereof. An insulating layer, a ceramic laminated wiring board, an organic film, and a lead frame are laminated one on another on the metal board so as to surround the semiconductor device chip. The lead frame is connected to the semiconductor device chip through the ceramic laminated wiring board. The assembly thus formed is sealed with a synthetic resin.
Ban Shunsuke
Harada Keizo
Maeda Takao
Takikawa Takatoshi
Yamanaka Shosaku
Fetherstonhaugh & Co.
Sumitomo Electric Industries Ltd.
LandOfFree
Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1535607