Semiconductor device

Details Semiconductor device Semiconductor device

H - Electricity

05

K

H05K 1/18 (2006.01) G06K 19/07 (2006.01) G06K 19/077 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01)

Patent

CA 2221315

A semiconductor device that includes two flexible card boards. The two boards are placed face to face at a given interval. An integrated circuit is placed between the two boards together with a condenser or a coil. The thickness of the integrated circuit, the condenser or the coil is 110 µm or less. The semiconductor device can be produced at a low cost due to the simple structure and be extremely resistant to breakage through bending stress.

Carte comportant un condensateur (114), un bobinage (115) et un circuit intégré mince (312) qui sont placés en sandwich entre une feuille de couverture supérieure (117) et une feuille de couverture inférieure (118). Les espaces entre lesdits éléments sont remplis à l'aide d'un adhésif (119). Etant donné que le condensateur (114), le bobinage (115) et le circuit intégré (312) sont extrêmement minces, il est possible d'obtenir un dispositif à semi-conducteur peu onéreux et extrêmement fiable qui ne peut se casser par pliage.

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