Semiconductor device

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Details

H01L 29/66 (2006.01) H01L 21/22 (2006.01) H01L 21/302 (2006.01) H01L 29/06 (2006.01)

Patent

CA 2196365

The present invention is directed to a semiconductor device having a semiconductor substrate having a main surface and an opposite surface and at least one p-n junction exposed partially to a side surface of the substrate and a multi-layered structure of passivation films having two or more passivation films coated on the side surface of said semiconductor substrate, wherein an interface polarization charge Qr (coulomb/cm2) induced in the vicinity of an interface between a first passivation film provided on the surface of said semiconductor substrate and a second passivation film provided on the surface of said first passivation film is in a relationship expressed by equation 1, 1.6 x 10 -8 ¦Qr¦ .... (1), and wherein a conductivity .sigma.1 of said first passivation film and a conductivity .sigma.2 of said second passivation film satisfy 0.05 .sigma.2/.sigma.1 10 .... (2), thereby, interface polarization which induces charge density is avoided to restrict variation or increasing of leakage current of the semiconductor device.

La présente invention est destinée à un dispositif à semi-conducteur comportant un substrat semi-conducteur ayant une surface principale et une surface opposée et au moins une jonction p-n exposée en partie à une surface latérale du substrat et une structure multicouche de films de passivation ayant deux films de passivation ou plus posés sur la surface latérale dudit substrat semi-conducteur, où une charge de polarisation d'interface Qr (coulomb/cm2) induite à proximité d'une interface située entre un premier film de passivation posé sur la surface dudit substrat semi-conducteur et un deuxième film de passivation posé sur la surface dudit premier film de passivation, est dans une relation exprimée par l'équation 1, 1.6 x 10-8 Qr et où une conductivité 1 dudit premier film de passivation et une conductivité 2 dudit deuxième film de passivation satisfont ainsi à l'équation 0,05 2/ 1 10, la polarisation d'interface qui induit une densité de charge étant évitée afin de restreindre la variation ou l'augmentation du courant de fuite du dispositif à semi-conducteur.

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