Semiconductor device and a method for fabricating the same

Details Semiconductor device and a method for fabricating the same Semiconductor device and a method for fabricating the same

H - Electricity

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356/134

H01L 23/48 (2006.01) H01L 21/56 (2006.01) H01L 23/28 (2006.01) H01L 23/31 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1217876

A SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME ABSTRACT OF THE DISCLOSURE In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.

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