H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 27/12 (2006.01) H01L 21/48 (2006.01) H01L 23/14 (2006.01) H01L 23/495 (2006.01)
Patent
CA 2072262
A plastic package type semiconductor device is composed of a rolled metal substrate made of copper or copper alloy and an insulating film formed on the surface of the substrate. The film may be a single-layer film made of silicon oxynitride or a composite film formed by laminating a silicon oxide layer and a silicon oxynitride layer (or a silicon nitride layer). A semiconductor element is mounted on the film or on the exposed surface of the substrate. Other passive elements are provided on the film. After connecting these elements with bonding wires, the entire device is sealed in a resin molding. This device is thus free of cracks due to difference in thermal expansion between the film and the substrate, or peeling due to moisture absorption.
Ban Shunsuke
Harada Keizo
Maeda Takao
Takikawa Takatoshi
Yamanaka Shosaku
Fetherstonhaugh & Co.
Sumitomo Electric Industries Ltd.
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