Semiconductor device and method of enveloping the...

H - Electricity – 05 – K

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356/143, 356/189

H05K 5/06 (2006.01) B29C 45/04 (2006.01) B29C 45/14 (2006.01) C08J 9/10 (2006.01) H01L 21/56 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01)

Patent

CA 1093704

ABSTRACT: In a semiconductor device comprising a semiconductor element, terminal conductors, which are in electrical connection with contact pads on the semiconductor element and an envelope of synthetic resin, the envelope is formed from an encapsulation, preferably an epoxy resin, protecting the semiconductor element and the electrical connections against ambient influences, and an envelope part of foamed thermoplastic synthetic resin which determines the outer shape and is provided around said encapsulation by means of injec- tion moulding.

296495

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