H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/522 (2006.01) H01L 21/44 (2006.01) H01L 21/441 (2006.01) H01L 21/48 (2006.01) H01L 21/74 (2006.01) H01L 21/762 (2006.01) H01L 21/98 (2006.01)
Patent
CA 2105039
A wafer structure suitable for the formation of semiconductor devices thereon and having a buried interconnect structure for interconnection of desired ones of the semiconductor devices according to a predetermined interconnection pattern and a method of making the same is disclosed. The wafer structure comprises a primary substrate having a first thickness appropriate for the formation of the desired semiconductor devices. The primary substrate further comprises a) conductive interconnection pads of a second thickness formed on a bottom surface of the primary substrate according to the predetermined interconnection pattern, b) first isolation pads of a third thickness formed on the bottom surface of the primary substrate between the conductive interconnection pads, and c) interconnection pad caps of a fourth thickness formed upon the surface of the interconnection pads opposite from the primary substrate, wherein the interconnection pad caps comprise a material suitable for wafer bonding, and further wherein the total thickness of the second thickness and the fourth thickness equals the third thickness. The structure further comprises a secondary substrate having an oxide layer thereon bonded to the interconnection pad caps and the first isolation pads of the primary wafer.
Buti Taqi Nasser
Hsu Louis Lu-Chen
Joshi Rajiv Vasant
Shepard Joseph Francis
International Business Machines Corporation
Saunders Raymond H.
LandOfFree
Semiconductor device and wafer structure having a planar... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and wafer structure having a planar..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and wafer structure having a planar... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1492062