Semiconductor device assembly and method of making same

Details Semiconductor device assembly and method of making same Semiconductor device assembly and method of making same

H - Electricity

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345/62

H01L 23/13 (2006.01) H01S 5/022 (2006.01) H01S 5/024 (2006.01) H01L 33/00 (2006.01)

Patent

CA 1274899

SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD OF MAKING SAME ABSTRACT OF THE DISCLOSURE The invention is a semiconductor device assembly and method of making the same. A mounting plate has positioning means for positioning the plate relative to a header, a first mounting surface of the plate is attached to the header and a semiconductor device is attached to a second mounting surface of the mounting plate. The assmbly is made by forming the mounting plate, positioning the mounting plate relative to the header by the positioning means, attaching the first mounting surface to the header and the semiconductor device to the second mounting surface. Another method of making the assembly is by defining and etching a mounting plate and attaching the first mounting surface to the header and the semiconductor device to the second mounting surface. This assembly and process provides an efficient means for mounting semiconductor devices and in particular electro-optic devices such as lasers.

531419

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