Semiconductor device-encapsulating epoxy resin composition

Details Semiconductor device-encapsulating epoxy resin composition Semiconductor device-encapsulating epoxy resin composition

C - Chemistry, Metallurgy

08

L

C08L 63/00 (2006.01) C08G 59/24 (2006.01) C08G 59/62 (2006.01) C08L 63/04 (2006.01) H01L 23/29 (2006.01)

Patent

CA 2061801

ABSTRACT OF THE DISCLOSURE SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95 by weight, based on the total epoxy resin composition, of a filler.

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