C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3038, 400/50
C08L 63/00 (2006.01) C08G 59/22 (2006.01) C08G 59/24 (2006.01) C08K 7/18 (2006.01) C08L 23/08 (2006.01) C08L 53/02 (2006.01) H01L 23/29 (2006.01)
Patent
CA 2039669
SEMICONDUCTOR DEVICE-ENCAPSULATING EPOXY RESIN COMPOSITION Abstract of the Disclosure Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A)containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.
Honda Shiro
Kayaba Keiji
Sawamura Yasushi
Tanaka Masayuki
Teshiba Toshihiro
Smart & Biggar
Toray Industries Inc.
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