Semiconductor device enclosure

Details Semiconductor device enclosure Semiconductor device enclosure

H - Electricity

01

L

356/172

H01L 23/02 (2006.01) H01L 23/051 (2006.01) H01L 23/48 (2006.01)

Patent

CA 1149084

- 10 - ABSTRACT OF THE DISCLOSURE A semiconductor device comprises a semiconductor wafer arranged between metallic connecting members for supplying electric current to, and leading it from, the wafer, each connecting member having a substantially cylindrical external part. A ring of a sulphone polymer or of polyphenylene sulphide, which may be reinforced with glass fibre material, has portions of its internal peripheral surface surrounding and firmly engaged with the cylindr- cal parts of the connecting members, the ring and the connecting members forming a protective casing around the semiconductor wafer.

346045

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