Semiconductor device package

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01L 23/02 (2006.01) H01L 23/047 (2006.01) H01L 23/10 (2006.01)

Patent

CA 2338931

A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The upper face of the seal ring is formed, at its at least two sides facing each other, into a concavely warped shape as viewed in vertical cross section, and the maximum warpage of the upper face of the seal ring is not more than 0.2% of the length of the side of the upper face.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device package will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1542572

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.