Semiconductor device with improved support member

Details Semiconductor device with improved support member Semiconductor device with improved support member

H - Electricity

01

L

356/167

H01L 23/12 (2006.01) H01L 23/492 (2006.01)

Patent

CA 1222576

52,200 ABSTRACT OF THE DISCLOSURE The present invention is directed to a semicon- ductor device having a support plate consisting of a central metal portion and a peripheral ring shaped portion consisting of a semiconductor material.

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