Semiconductor die attach system

Details Semiconductor die attach system Semiconductor die attach system

H - Electricity

01

L

356/109

H01L 23/12 (2006.01) H01L 21/58 (2006.01) H01L 21/60 (2006.01) H01L 23/373 (2006.01)

Patent

CA 1249669

ABSTRACT A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.

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