C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/00 (2006.01) C08G 59/30 (2006.01) C08G 59/32 (2006.01) C08K 5/00 (2006.01) C08K 5/523 (2006.01) H01L 23/29 (2006.01)
Patent
CA 2173681
An epoxy resin composition comprising (A) 20-80 parts by weight of an epoxy resin, (B) 20-80 parts by weight of a curing agent, (C) 0.1-50 parts by weight of a phosphorus- containing flame retardant, and (D) 200-1,200 parts by weight of an inorganic filler cures into products having improved high-temperature exposure resistance, flame retardancy, and reflow cracking resistance. The composition eliminates blending of antimony trioxide and brominated compounds and is useful in encapsulating semiconductor devices for imparting high-temperature reliability.
Aoki Takayuki
Asano Eiichi
Flury Peter
Okada Tadashi
Scharf Wolfgang
Shin-Etsu Chemical Co. Ltd.
Smart & Biggar
Vantico Ag
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