F - Mech Eng,Light,Heat,Weapons – 21 – V
Patent
F - Mech Eng,Light,Heat,Weapons
21
V
F21V 29/00 (2006.01) H01L 23/34 (2006.01) H01L 33/00 (2006.01)
Patent
CA 2666286
A semiconductor light-emitting module includes a heat-dissipating member (11,11',11~,21), a heat-conducting unit(12,22), and a diode light-emitting device (13,23). The heat-dissipating member is provided with an isolator member (14,14',14~,24) coupled on the first side (112) of the heat-dissipating member. The heat-dissipating member has the second side (114) corresponding to the first side (112). The isolator member is provided with the third side (116) corresponding to the first side (112). An environment temperature around the third side (116) is higher than that around the second side (114). The heat-conducting unit (12,22) has a flat end (122) and a contact portion (124). The contact portion (124) is jointed tightly with the heat-dissipating member (11,11',11~,21). The diode light-emitting device (13,23) is disposed on the flat end (122) of the heat-conducting device (12,22).
Module luminescent à semi-conducteurs comprenant un élément de dissipation thermique (11,11',11~,21), une unité thermoconductrice(12,22), et un dispositif luminescent à diode (13,23). L'élément de dissipation thermique comporte un élément d'isolation (14,14',14~,24) couplé du premier côté (112) de l'élément de dissipation thermique. L'élément d'isolation est sur le troisième côté (116) correspondant au premier côté (112). Une température ambiante autour du troisième côté (116) est supérieure à celle autour du second côté (114). L'unité thermoconductrice (12,22) comporte une extrémité plate (122) et une partie de contact (124), laquelle est jointe en ajustement serré à l'élément de dissipation thermique(11,11',11~,21). Le dispositif luminescent à diode(13,23) se trouve sur l'extrémité plate (122) du dispositif thermoconducteur (12, 22).
Chen Jen-Shyan
Mbm Intellectual Property Law Llp
Neobulb Technologies Inc.
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