Semiconductor integrated circuit packages

Details Semiconductor integrated circuit packages Semiconductor integrated circuit packages

H - Electricity

01

L

356/146

H01L 23/12 (2006.01) H01L 23/495 (2006.01) H01L 23/50 (2006.01)

Patent

CA 1277436

Abstract of the Disclosure A lead frame for mounting a semiconductor chip in an integrated circuit package incorporates a deformation absorbing member as an integral part of the paddle support arm so that the initial, desired physical and electrical characteristics are unaltered after a forming operation such as paddle downsetting.

551505

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