Semiconductor laser device and method of making same

H - Electricity – 01 – S

Patent

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H01S 5/02 (2006.01) H01S 3/025 (1990.01) H01S 3/085 (1990.01)

Patent

CA 2088754

ABSTRACT OF THE DISCLOSURE A semiconductor laser device includes a laser chip and a submount. The laser chip includes a mesa-shaped semiconductor substrate having a surface on which a plurality of layers required for generating laser oscillations are epitaxially grown to be conformal to the surface contour of the substrate. The laser chip is soldered upside down to the submount. If solder rises up along the side surfaces of the laser chip, it does not short-circuit a PN junction contained in the epitaxially grown layers.

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