Semiconductor laser module of dual in-line package type

H - Electricity – 01 – L

Patent

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345/41, 345/62

H01L 23/34 (2006.01) G02B 6/42 (2006.01) H01L 23/02 (2006.01) H01L 23/12 (2006.01) H01S 5/022 (2006.01) H01S 5/024 (2006.01) H01S 5/062 (2006.01)

Patent

CA 1292798

ABSTRACT OF THE DISCLOSURE A semiconductor laser module containing a semiconductor laser therein is disclosed, in which the insulated conductor of a coaxial-type high-frequency connector fixed to the outer wall surface of a dual in-line package is connected to an airtight terminal mounted on the package and connected electrically with the semiconductor laser in the package. Thus, a high- frequency signal in the giga bit band can be readily applied to the semiconductor laser through the coaxial- type high-frequency connector, without degrading the airtightness of the dual in-line package.

570743

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