H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 33/48 (2010.01) H01L 33/50 (2010.01) H01L 33/62 (2010.01)
Patent
CA 2547832
A submount for a semiconductor light emitting device (12) includes a semiconductor substrate (14) having a cavity (16) therein configured to receive the light emitting device (12). A first bond pad (22A) is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad (22B) is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member (32) and methods for forming the same are also provided.
L'invention concerne une embase de dispositif électroluminescente à semi-conducteurs, qui comprend un substrat de semi-conducteurs comportant une cavité configurée dedans, de manière à loger le dispositif électroluminescent. Un premier plot de connexion est positionné dans ladite cavité, afin d'assurer le couplage avec un premier noeud du dispositif électroluminescent logé dans la cavité. Un second plot de connexion est positionné dans la cavité, afin d'assurer le couplage avec un second noeud du dispositif électroluminescent positionné dedans. L'invention concerne également des dispositifs électroluminescents comprenant un élément de conversion de longueur d'ondes solide, ainsi que des procédés de production correspondants.
Andrews Peter S.
Hiller Norbert
Ibbetson James
Keller Bernd
Negley Gerald H.
Cree Inc.
Sim & Mcburney
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