Semiconductor memory chip module

G - Physics – 11 – C

Patent

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Details

G11C 11/00 (2006.01) G06K 19/073 (2006.01) G06K 19/077 (2006.01) H01L 25/18 (2006.01) H01L 25/065 (2006.01)

Patent

CA 2377175

In a semiconductor memory chip module (2') for a smart card, a nonvolatile memory chip (EEPROM) (4) and a volatile memory chip (SRAM) (6) are stacked and coupled directly by vertical chip interconnections (16). The rapid-access volatile memory permits fast execution of programs. Permanent and safe storage of data is effected by reloading the data to the nonvolatile memory. A chip (8) with decoder circuits can be contained in a further level. Likewise integrated into a chip is a buffer capacitor (20) which is constantly recharged to a constant supply voltage during operation.

Dans un module microplaquette semiconductrice (2') destiné à une carte à puce, une puce mémoire non volatile (EEPROM) (4) et une puce mémoire volatile (SRAM) (6) sont empilées l'une sur l'autre et directement couplées par des interconnexions verticales (16). La mémoire volatile à accès rapide permet l'exécution rapide de programmes. La mémorisation durable et sûre de données s'effectue par transfert des données dans la mémoire non volatile. Une puce (8) peut contenir à un autre niveau des circuits décodeurs. De même, une puce (8) peut intégrer un condensateur tampon (20) qui, en service, est constamment rechargé à une tension d'alimentation constante.

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