H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/9
H05K 1/18 (2006.01) B23K 35/26 (2006.01) H01L 21/60 (2006.01) H01L 23/485 (2006.01) H01L 23/49 (2006.01)
Patent
CA 2031111
ABSTRACT OF THE DISCLOSURE A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electri- cally connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material pro- duced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additive elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is HB 6 or higher.
Marks & Clerk
Tanaka Denshi Kogyo Kabushiki Kaisha
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