Semiconductor package with high density i/o lead connection

Details Semiconductor package with high density i/o lead connection Semiconductor package with high density i/o lead connection

H - Electricity

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L

356/143

H01L 23/48 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01)

Patent

CA 1252912

-9- SEMICONDUCTOR PACKAGE WITH HIGH DENSITY I/O LEAD CONNECTION Abstract Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers backed by an insulating tape are bonded to the ends of the fingers on a lead frame. The tape fingers are electrically coupled to the bond pads on one major surface of the semiconductor chip by wire bonding. In one embodiment, the opposite major surface of the chip is bonded to a paddle on the lead frame through an aperture in the tape for maximum heat dissipation.

537983

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