Semiconductor photodetector device and method of...

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H01L 31/07 (2006.01) H01L 31/0304 (2006.01) H01L 31/107 (2006.01) H01L 31/18 (2006.01)

Patent

CA 2007670

Abstract of the Disclosure Disclosed are an avalanche photodiode and a manufacturing method thereof. An n?-type InGaAs light absorption layer and n?-type InP window layer are formed on an n-type InP substrate by crystal growth, in the order mentioned. A depression is formed in a selected surface portion of the window layer, and n-type impurities are doped into the bottom of the depression, to thereby form an n-type high concentration region. Further, n?-type crystal- grown InP layer is formed in the depression in such a way as to fill the depression. A guard ring is formed around the depression by the doping of p-type impuri- ties. By doping p-type impurities into the window layer, a p-type high concentration region is formed in the window layer in a manner completely surrounding the interface between the n-type high concentration region and the crystal-grown InP layer. The n-type and p-type high concentration regions define a junction serving as a light-receiving region. Since the inter- face of the crystal-grown InP layer, which may not have a satisfactory crystalline structure, is located within the p-type high concentration region, that interface is not supplied with a high electric field during use. Accordingly, the performance of the avalanche photodiode is not influenced by the interface.

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