G - Physics – 01 – L
Patent
G - Physics
01
L
73/70, 349/67.8
G01L 1/22 (2006.01)
Patent
CA 1170077
D-4,935 C-3301 SEMICONDUCTOR PRESSURE SENSOR WITH SLANTED RESISTORS Abstract of the Disclosure A diaphragm is formed in a silicon chip by etching a rectangular cavity in one side thereof and piezoresistive resistors are formed in the other surface of the chip to sense stress changes on the diaphragm due to pressure changes. At least one resistor is placed along the edge of the diaphragm where a sharp stress peak occurs. To avoid the problem of inaccurate placement of the resistor relative to the peak, the resistor is slanted with respect to the stress ridge at a small angle of 10° to 20°. This makes the resistor placement and cavity alignment much less critical thereby assuring greater uniformity of response from one sensor to another at the expense of signal size for a given pressure change on the device.
411049
Brown Ronald E.
Edison Lamonte R.
Higdon William D.
General Motors Corporation
Gowling Lafleur Henderson Llp
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