H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/15, 356/31,
H01L 25/00 (2006.01) H01L 23/538 (2006.01) H04Q 3/52 (2006.01)
Patent
CA 1133147
ABSTRACT OF THE DISCLOSURE A semiconductor speech path switch comprises a plurality of semiconductor chips each including a crosspoint element and speech path wirings multilayered on a wiring plate with an intervention of an insulating layer. A plurality of pedestals for interconnection between crosspoint elements are provided directly or by throughholes on the wiring plate. Speech path row and column terminals and selection path row and column terminals are disposed adjacent one another on respective sides of the wiring plate, the terminals being connected to corresponding speech path and selection path wirings on the wiring plate by face-down bonding so that the crosspoint elements may be connected to each other to form a semiconductor speech path switch in an mxn matrix array as well as a unitary matrix array. Such construction simplifies chip manufacture, eliminates multi-layered wiring, lessens crosstalk among row and column wiring paths and facilitates grid wiring.
325846
Gowling Lafleur Henderson Llp
Hitachi Ltd.
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