G - Physics – 01 – L
Patent
G - Physics
01
L
356/200, 73/70
G01L 1/22 (2006.01) G01P 1/02 (2006.01) G01P 15/08 (2006.01) G01P 15/09 (2006.01)
Patent
CA 2024338
A semiconductor strain sensor comprising a substrate having a lead hole in which a lead terminal is installed so as to be electrically coupled to an external circuit and a sensor chip joined with the substrate and having piezo-resistors to a bridge circuit. A shell is joined with the front surface of the substrate by means of a projection welding technique after the back surface of the substrate is flattened, said sensor chip being covered by the shell and a space formed by the shell and the substrate being filled with a damping liquid. The substrate is integrally coupled to the sensor chip through an adhesive, and spacers are added to the adhesive so as to keep the thickness of the adhesive to a predetermined value. This arrangement can effectively prevent the propagation of the welding strain of the substrate into the sensor chip.
Cette invention concerne un capteur extensométrique à semiconducteur formé d'un substrat comportant un trou de connexion muni d'une borne reliée à un circuit extérieur et d'une puce de détection liaisonnée au substrat avec des composants piézorésistifs raccordés à un montage en pont. Une coquille soudée par bossages sur la face avant du substrat après aplatissement de son sa face arrière sert à encapsuler la puce dans un bain de liquide amortisseur. La puce de détection est intégrée au substrat au moyen d'une couche d'adhésif dans laquelle sont noyées des cales d'épaisseurs servant à maintenir l'épaisseur de ladite couche à une valeur prédéterminée. Ce montage permet de prévenir efficacement la propagation des contraintes de soudage du substrat à la puce de détection.
Imai Masahito
Kondo Munenari
Maeda Takushi
Narita Ryoichi
Borden Ladner Gervais Llp
Imai Masahito
Kondo Munenari
Maeda Takushi
Narita Ryoichi
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