H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/02 (2006.01) F27D 7/00 (2006.01) H01L 21/00 (2006.01) H01L 21/477 (2006.01)
Patent
CA 2261391
In summary, the vertical rapid cooling furnace of this invention for treating semiconductor wafers with self contained gas chilling and recycling comprises a hot wall reaction tube positioned within a cylindrical array of heating coils. Space between the hot wall reaction tube and said array of heating coils provides a cooling gas passageway therebetween. The cooling gas passageway has an inlet and an outlet, a chilled gas inlet communicating with the inlet of the cooling gas passageway and a heated gas outlet communicating with the outlet of the cooling gas passageway. The furnace includes a heat exchanger having a hot gas inlet and a chilled gas outlet, the hot gas inlet thereof communicating with said heated gas outlet, and the chilled gas outlet communicating with said cooling gas passageway inlet. With this system, heated gas from the cooling gas passageway can be chilled to remove heat therefrom and returned to the cooling gas passageway to remove heat from the furnace. The furnace preferably includes a fan placed between the chilled gas outlet and the cooling gas passageway inlet and valves for isolating the heat exchanger from the furnace during its heating cycle.
Bolton Douglas A.
Wiesen Patrick W.
Goudreau Gage Dubuc
Silicon Valley Group Inc.
LandOfFree
Semiconductor thermal processor recirculating heater does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor thermal processor recirculating heater, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor thermal processor recirculating heater will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2012160