Semiconductor thin film and thin film device

H - Electricity – 01 – L

Patent

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Details

H01L 21/205 (2006.01) C23C 16/24 (2006.01) H01L 31/075 (2006.01) H01L 31/18 (2006.01)

Patent

CA 2338314

A semiconductor thin film which is deposited by using a chemical vapor deposition method at an underlying layer temperature of 400°C or less, and contains, as main component elements, a Group IV atom and hydrogen atom. A temperature dependency of an amount of release of hydrogen atoms within the film when the film is heated from room temperature exhibits a profile having a peak of the hydrogen releasing amount at 370°C or higher and 410°C or less, and a half-value width of the peak is 30°C or less. Also disclosed is a thin film device having a semiconductor unit portion including this semiconductor thin film, and an electrode portion including an electrically conductive thin film, wherein these portions are formed on the same substrate.

Couche mince de semi-conducteur contenant, en tant que constituants principaux, un élément de groupe IV et de l'hydrogène déposés dans des conditions de température du substrat inférieure à 400 DEG C par un procédé de dépôt chimique en phase vapeur. La quantité d'atomes d'hydrogène libérés de la couche mince quand on réchauffe cette dernière depuis la température ambiante est dépendante de l'élévation de la température, comme le montre une courbe dont le profil présente une crête dans une plage située entre 370 DEG C et 410 DEG C. La moitié de la largeur de la crête est inférieure à 30 DEG C. L'invention concerne également un composant à couche mince possédant une partie semi-conducteur comprenant cette couche mince et une partie électrode comprenant une couche mince conductrice, ces deux parties étant constituées sur le même substrat.

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