Semiconductor wafer processing adhesives and tapes

Details Semiconductor wafer processing adhesives and tapes Semiconductor wafer processing adhesives and tapes

H - Electricity

01

L

H01L 21/68 (2006.01) H01L 21/77 (2006.01) H01L 21/78 (2006.01)

Patent

CA 2224774

A semiconductor wafer processing tape comprises a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing. Optionally, the adhesive may include an adhesion modifier such as a tackifying resin, a liquid rubber or a photocrosslinking agent. The tapes are useful for both wafer grinding and wafer dicing applications. A method of processing semiconductor wafers is disclosed.

L'invention porte sur des rubans adhésifs utilisés dans le traitement des plaquettes de semi-conducteurs comportant un substrat permanent et une couche d'adhésif non autocollant consistant en un élastomère thermoplastique du type copolymère bloc déposé sur le substrat. L'adhésif peut facultativement comporter un modificateur d'adhérence tel qu'une résine collante, du caoutchouc liquide ou un agent photo réticulant. Ces rubans peuvent servir dans les opérations de meulage et de découpage en puces des plaquettes. L'invention porte également sur un procédé de traitement associé des plaquettes.

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