Semisolid thermal interface with low flow resistance

Details Semisolid thermal interface with low flow resistance Semisolid thermal interface with low flow resistance

C - Chemistry, Metallurgy

09

D

C09D 183/07 (2006.01) H01L 23/36 (2006.01) H01L 23/373 (2006.01)

Patent

CA 2207114

An interface material for use in forming a coating interposed along a heat dissipating path between a solid state electronic device and a heat sinking surface. The coating consists of a formulation of a thermally stable wax which is formed as a polyorganosiloxane graft polymer of octadecene and a methylsiloxane host blended with a thermally conductive viscosity stabilizer consisting of a thermally conductive particulate material such as alumina, boron nitride, among others. The graft polymer, with its molecular weight of between approximately 10,000 and 15,000 has a density of between about 0.8 and 0.9 with a melting point of between about 30 degrees C. and 90 degrees C.

Affiliated with

Also associated with

Rating

Semisolid thermal interface with low flow resistance does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semisolid thermal interface with low flow resistance, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semisolid thermal interface with low flow resistance will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1756119