Sensitization of polyimide polymer for electroless metal...

Details Sensitization of polyimide polymer for electroless metal... Sensitization of polyimide polymer for electroless metal...

H - Electricity

05

K

117/77

H05K 3/18 (2006.01) C09K 13/02 (2006.01) C23C 18/16 (2006.01) C23C 18/28 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1053994

ABSTRACT A metal layer is formed on the surface of a body of a polyimide polymer by sensitising the surface by treatment with a solution of an alkali hydroxide and a hydrazine; depositing on the sensitised surface a catalyst which is catalytic to an electroless metal-plating bath and treating the sensitised and catalysed surface with such a bath. Parts of the sensitised surface may be masked and the sensitisation of the unmasked parts deactivated (e.g. by exposure to ultraviolet radiation) before deposition of the catalyst. The preferred sensitising solution is of hydrazine hydrate and sodium hydroxide.

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