Sensor substrate and method of fabricating same

G - Physics – 01 – N

Patent

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Details

G01N 27/30 (2006.01) A61B 5/145 (2006.01) G01N 27/00 (2006.01) G01N 27/404 (2006.01) G01N 27/416 (2006.01)

Patent

CA 2459401

A substrate (16) with hermetically sealed vias (18) extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One sideof the substrate may include a sensing element (12) and another side of the substrate may include sensing electronics (14).

La présente invention concerne, d'une part un substrat (16) aux trous de passage (18) hermétiquement fermés joignant entre elles les deux faces du substrat, et d'autre part un procédé de fabrication correspondant. Les trous de passage peuvent être comblés d'un matériau conducteur tel qu'une encre sans fritte. Le tracé conducteur formé par le matériau conducteur participe à l'occlusion d'une face à l'autre du substrat. L'une des faces du substrat peut comporter un élément de sonde (12), l'autre face du substrat comportant les circuits électroniques (14) desservant la sonde.

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