H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/8
H05K 3/34 (2006.01) H05K 13/04 (2006.01)
Patent
CA 1219962
A SHAPED SOLDER PAD FOR REFLOW SOLDERING OF SURFACE MOUNTING CYLINDRICAL DEVICES ON A CIRCUIT BOARD Abstract of the Disclosure A solder pad is provided at each end of a mounting position for a cylindrical electronic device on a circuit board. Each solder pad has two humps of solder spaced apart in a direction normal to the axis of the device, the humps defining a channel in which the end of a device can rest prior to being reflow soldered. The humps have a convex arcuate outer surface in plan view and when viewed in a direction parallel to the axis of the device has a profile which is of convex arcuate form. The humps are formed by depositing a thick patch of solder paste at each hump position and heating the circuit board and solder paste to melt the paste. After positioning of devices, the solder is reflowed to attach the devices. - i -
484176
Ho Thomas K.y.
Van Den Brekel Jacques
Jelly Sidney Thomas
Nortel Networks Limited
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